{"id":677373,"date":"2026-04-01T16:45:16","date_gmt":"2026-04-01T14:45:16","guid":{"rendered":"https:\/\/technikrat.de\/produkt\/lotpaste-dp5505-sn965ag30cu05-korngroesse-typ-5-10cc-kartusche-mit-flussmittel-rol0\/"},"modified":"2026-04-04T17:31:54","modified_gmt":"2026-04-04T15:31:54","slug":"lotpaste-dp5505-sn965ag30cu05-korngroesse-typ-5-10cc-kartusche-mit-flussmittel-rol0","status":"publish","type":"product","link":"https:\/\/technikrat.de\/en\/produkt\/lotpaste-dp5505-sn965ag30cu05-korngroesse-typ-5-10cc-kartusche-mit-flussmittel-rol0\/","title":{"rendered":"Interflux solder paste DP5505, Sn96.5Ag3.0Cu0.5 grain size type 5, 10cc cartridge, with flux ROL0"},"content":{"rendered":"<p>Interflux solder paste DP5505<\/p>\n<p>The solder paste has been developed to minimize the \u201chidden pillow defect\u201d when soldering BGAs.<\/p>\n<p>Fields of application:<br \/>\nManual dispensing with cartridge and cannula<br \/>\nUse in automatic dispensers<\/p>\n<p>Properties:<br \/>\nNo-clean<br \/>\nHalogen-free<br \/>\nLead-free<br \/>\nMinimal and transparent flux residues<br \/>\nReduced formation of cavities (voids)<br \/>\nThe solder paste complies with IPC 7095, class 3 cavity formation<\/p>\n<p>Alloy: Sn96.5Ag3.0Cu0.5<br \/>\nGrain size type 5<br \/>\nForm of delivery: 10cc cartridge<br \/>\nFlux: ROL0 no clean<br \/>\nMetal content: 87%<br \/>\nMelting point: 217\u00b0C<br \/>\nContents: 30 g solder paste<\/p>\n<p>Storage:<br \/>\nIn closed original container at 3-7\u00b0C<\/p>\n<p>Handling:<br \/>\nTo avoid condensation, allow the solder paste to warm up slowly to room temperature before opening.<\/p>\n<p>The technical data sheet can be found here under Documents.<\/p>","protected":false},"excerpt":{"rendered":"<p>Interflux solder paste DP5505 The solder paste has been developed to minimize the \u201chidden pillow defect\u201d when soldering BGAs. Fields of application: Manual dispensing with cartridge and cannula Use in automatic dispensers Properties: No-clean Halogen-free Lead-free Minimal and transparent flux residues Reduced formation of cavities (voids) The solder paste complies with IPC 7095, class 3 [&hellip;]<\/p>\n","protected":false},"featured_media":677407,"template":"","meta":{"ep_exclude_from_search":false},"product_cat":[143],"product_tag":[],"class_list":{"0":"post-677373","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-loetzinn-flussmittel","7":"product_shipping_class-postwarenpost-individuell","9":"first","10":"instock","11":"taxable","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/technikrat.de\/en\/wp-json\/wp\/v2\/product\/677373"}],"collection":[{"href":"https:\/\/technikrat.de\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/technikrat.de\/en\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/technikrat.de\/en\/wp-json\/wp\/v2\/media\/677407"}],"wp:attachment":[{"href":"https:\/\/technikrat.de\/en\/wp-json\/wp\/v2\/media?parent=677373"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/technikrat.de\/en\/wp-json\/wp\/v2\/product_cat?post=677373"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/technikrat.de\/en\/wp-json\/wp\/v2\/product_tag?post=677373"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}